全耀传感科技（厦门）有限公司
全耀传感科技（厦门）有限公司
TTCSENSE热成像传感器采用CMOS长波红外混合热感应架构和晶圆级真空封装（WLVP）技术，使其生产成本相比传统使用感光耦合元件（CCD）大幅度降低，同时功耗也大幅度下降，非常适用于消费类智能电子电器产品。
TTCSENSE热成像传感器 五大优越性能：
1.CMOS生产工艺
2.微型晶圆级真空封装（WLVP）
3.无需冷处理，无需快门
4.易于校准标定，适合大批量生产
5.超低功耗≤50mW
TTCSENSE热成像处理器功能：
1.处理严格的时序要求和热图像采集
2. 处理每个像素的校准以及温度转换
3.处理不均一，环境 温度和电压校正
4.联接用于温度处理的外部处理器
5.主机系统的标准接口通讯：
5.1. SPI/I2C用于数据和控制/状态
5.2. USB 用于控制与数据
| Detector | GVM12D2 Camera Module | Thermal LWIR |
| IR Wavelength | 8 - 14μm | |
| Array size | 80 (H) x 62 (V) | |
| Detector pitch | 45μm (H) x 45μm (V) | |
| Maximum frame rate | 30 FPS | |
| Max scene temperature range* | -40°C to 1000°C | |
| NETD *(Ge Lens) | TBD | |
| Number of dead detectors | 1% | |
| Accuracy* | TBD | |
| Environmental | Operating temperature | -20 - 85°C |
| Storage temperature | -40 - 85°C | |
| Altitude (pressure) | TBD kpa | |
| Relative Humidity | TBD % | |
| Shock | TBD | |
| Interface | Power supply | 5V |
| Power Consumption* | 200mW (Camera Module & GVC12D4 Thermal Image | |
| Processor) | ||
| Host interface | USB 2.0 | |
| Mechanical | Evaluation Kit size | 54mm x 52mm x TBDmm |
| Evaluation Kit weight | TBD g |
GVM12D2xx热成像模组应用领域：
| Applications | |
| Appliances | Fridge Microwave |
| HVAC | |
| Automation | Occupancy, people counting - Lighting control Electrical faults |
| Fire door control, security and safety camera | |
| Industrial | Thermal measurement devices |
| Security | Surveillance Fire Safety |
| Baby monitor | |
| Automotive | Autonomous driving |
| Compartment occupancy | |
| Medical | Thermography |
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